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Author Lau, John H.
Title Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies.
Publication Info New York : McGraw-Hill, 2000.


LOCATION SHELVED AT LOAN TYPE STATUS
 BJL 3rd Floor  TK 7874 L3  8 WEEK LOAN  AVAILABLE

Descript 585p.
ISBN 0071351418
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Author Lau, John H.
Subject Multichip modules (Microelectronics) -- Design and construction.
Microelectronic packaging.
Descript 585p.
ISBN 0071351418
Author Lau, John H.
Subject Multichip modules (Microelectronics) -- Design and construction.
Microelectronic packaging.
LOCATION SHELVED AT LOAN TYPE STATUS
 BJL 3rd Floor  TK 7874 L3  8 WEEK LOAN  AVAILABLE

Subject Multichip modules (Microelectronics) -- Design and construction.
Microelectronic packaging.
Descript 585p.
ISBN 0071351418

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