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BJL CLASSMARK
KDL CLASSMARK
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KDL, Scarborough
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Record:
Author
Lau, John H.
Title
Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies.
Publication Info
New York : McGraw-Hill, 2000.
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LOCATION
SHELVED AT
LOAN TYPE
STATUS
BJL 3rd Floor
TK 7874 L3
8 WEEK LOAN
AVAILABLE
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Descript
585p.
ISBN
0071351418
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Author
Lau, John H.
Subject
Multichip modules (Microelectronics) -- Design and construction.
Microelectronic packaging.
Descript
585p.
ISBN
0071351418
Author
Lau, John H.
Subject
Multichip modules (Microelectronics) -- Design and construction.
Microelectronic packaging.
LOCATION
SHELVED AT
LOAN TYPE
STATUS
BJL 3rd Floor
TK 7874 L3
8 WEEK LOAN
AVAILABLE
Subject
Multichip modules (Microelectronics) -- Design and construction.
Microelectronic packaging.
Descript
585p.
ISBN
0071351418
Persistent link to this item
Click link and copy URL from browser navigation toolbar
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