LEADER 00000nam 2200205 a 4500
001 0071351418
007 t
008 011106s2000 xxua rb 001 eng
020 0071351418
040 CURLLC
050 4 TK 7874 L3
100 1 Lau, John H.
245 10 Low cost flip chip technologies :|bfor DCA, WLCSP, and
PBGA assemblies.
260 New York :|bMcGraw-Hill,|c2000.
300 585p.
650 0 Multichip modules (Microelectronics)|xDesign and
construction.
650 0 Microelectronic packaging.
|